google.com,pub-1990720073119592, DIRECT, f08c47fec0942fa0 Fix Screen and Firmware: High-Voltage Scan Driver for TFT
Showing posts with label High-Voltage Scan Driver for TFT. Show all posts
Showing posts with label High-Voltage Scan Driver for TFT. Show all posts

Saturday, January 8, 2022

High-Voltage Level-Shifting Scan Driver

 Dual, High-Voltage Scan Driver for TFT



GOFF Rapid Discharge Function (DISH Input)

The DISH input controls a switch between GOFF and 

AGND. When DISH is pulled below ground by at least 

1V, VGOFF is rapidly discharged to AGND. Typically 

DISH is capacitively coupled to VDD so that if VDD falls 

suddenly, VGOFF is quickly discharged to AGND.

Thermal-Overload Protection

The thermal-overload protection prevents excessive 

power dissipation from overheating the device. When 

the junction temperature exceeds TJ = +160°C, a thermal sensor immediately shuts down the scan driver outputs. The outputs are set to high impedance. Once the 

device cools down by approximately 15°C, the device 

reactivates.

The thermal-overload protection protects the IC in the 

event of overheat conditions. For continuous operation, 

do not exceed the absolute maximum junction temperature rating of TJ = +150°C.

 Applications Information

Power Dissipation

An IC’s maximum power dissipation depends on the 

thermal resistance from the die to the ambient environment and the ambient temperature. The thermal resistance depends on the IC package, PCB copper area, 



other thermal mass, and airflow.

The MAX17109, with its exposed backside pad soldered 

to 1in2 of PCB copper, can dissipate about 34.5mW into 

+70°C still air. More PCB copper, cooler ambient air, and 

more airflow increase the possible dissipation, while 

less copper or warmer air decreases the IC’s dissipation capability.

Scan Driver Outputs

The power dissipated by the scan driver outputs (CKV1, 

CKVB1, STVP1, CKV2, CKVB2, and STVP2) depends on 

the scan frequency, the capacitive load, and the difference between the GON and GOFF supply voltages:

where fSCAN is the scan frequency of the panel, CPANEL 

is the panel model capacitive load, VGON and VGOFF

are the positive gate-on and negative gate-off voltages.

If both scan drivers operate at a frequency of fSCAN = 

50kHz, the load of the six outputs is CPANEL = 5nF, and 

the supply voltage difference is VGON - VGOFF = 30V, 

then the power dissipated is 1.35W.

PCB Layout and Grounding

Careful PCB layout is important for proper operation. 

Use the following guidelines for good PCB layout:

1) Place the GON, GOFF, and VDD pin bypass capacitors as close as possible to the device. The ground 

connections of the GON, GOFF, and VDD bypass 

capacitors should be connected directly to the 

AGND pin with a wide trace.

2) Avoid using vias in the high-current paths. If vias 

are unavoidable, use many vias in parallel to reduce 

resistance and inductance.

3) Connect the MAX17109’s exposed paddle to AGND 

copper plane and the copper plane area should be 

maximized to improve thermal dissipation.

4) Minimize the length and maximize the width of the 

traces between the CKV, CKVB, and STV output nodes 

and the panel load for best transient responses.

Refer to the MAX17109 evaluation kit for an example of proper board.


Dual, High-Voltage Scan Driver for TFT LCD

______________________________________________

High-Voltage Level-Shifting Scan Driver

The MAX17109 includes two, 3-channel, high-voltage, 

level-shifting scan drivers. The scan driver outputs 

(CKV1, CKV2, CKVB1, CKVB2, STVP1, and STVP2) 

swing between the power-supply rails (VGON and 

VGOFF) according to their corresponding input logic 

levels. The states of the CKV1, CKVB1, and STVP1 outputs are determined by the input logic levels present on 

OE, OECON, STV1, and CPV1. The states of the CKV2, 

CKVB2, and STVP2 outputs are determined by the input 

logic levels present on OE, OECON, STV2, and CPV2 

(See Figure 3, Tables 1 and 2.)

STV1 and STV2 are the vertical timing signals. CPV1 

and CPV2 are the horizontal timing signals. OE is the 

output-enable signal. OECON is a timing signal derived 

through an RC filter from OE that blanks OE if OE stays 

high for too long. These signals have CMOS input logic 

levels set by the VDD supply voltage. CKV1 and CKV2 

are scan clock outputs, which are complementary to 

scan clock outputs CKVB1 and CKVB2, respectively. 

STVP1 and STVP2 are the output scan start signals. 

These output signals swing from VGON to VGOFF, which 

have a maximum upper level of +40V, a minimum lower 

level of -30V, and a combined maximum range of VGON

- VGOFF = 65V. Their low output impedance enables 

them to swiftly drive capacitive loads. The input pins 

CKVCS1, CKVBSC1, CKVBCS2, and CKVBCS2 allow 

the charge in the panel equivalent capacitors to be 

shared. This reduces the power loss in state transition. 


 General Description

The MAX17109 includes two high-voltage, level-shifting 

scan drivers for TFT panel integrated gate logic. Each 

scan driver has 2 channels that switch complementarily. The scan driver outputs swing from +40V to 

-30V and can swiftly drive capacitive loads. To save 

power, the scan driver’s complementary outputs share 

the charge of their capacitive load before they change 

states.

The MAX17109 is available in a 32-pin, 5mm x 5mm, 

thin QFN package with a maximum thickness of 0.8mm 

for ultra-thin LCD panels.

 Applications

Notebook Computer Displays

LCD Monitor and TV Panels

 Features

♦ +40V to -30V Output Swing Range

♦ Fast Slew Rate for High Capacitive Load

♦ Load Charge Sharing for Power Saving

♦ 32-Pin, 5mm x 5mm, Thin QFN Package




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